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the channels from being integrated into cir-cuits to provide direct cooling at hotspots. Because such integration greatly increases the complexity of chip fabrication, it would poten - tially increase the cost. On page 211, van Erp et al.1 report an electronic device designed to have an integrated microfluidic cooling
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B. Dang et al., "A Chip-Scale Cooling Scheme With Integrated Heat Sink and Thermal-Fluidic I/O Interconnects," in ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference, 2005, vol. Advances in Electronic Packaging, Parts A, B, and C,
